HomeMy WebLinkAboutPROSPECT INDUSTRIAL PARK, LOT 19 - PDP - 28-98E - SUBMITTAL DOCUMENTS - ROUND 1 - LETTER OF INTENTJanuary 25, 2007
City of Fort Collins
Engineering — Development Review
281 North College Avenue
Fort Collins, Colorado 80522
RE: Letter of Intent for Slope Easement
Lot 19, Prospect Industrial Park (Holsinger Drywall)
To Whom It May Concern:
Liberty Common School has been made aware that a certain amount of grading is needed
on our site (Lot 6, Prospect Industrial Park) for the development of the above project. It
appears that this construction will not adversely impact our property, and we feel that it
will be possible to negotiate and dedicate a 2' wide Slope Easement adjacent to the
project prior to the approval of the Final Development Plans.
Sincerely,
L, uil j.n r-
Peter Kast, President
1725 Sharp Point Drive
Fort Collins, Colorado 80525
Page 1 of 1
Steve Olt - Letter of Intent - Lot 19 Prospect Industrial - Holsinger
Drywall
From: "Mike Oberlander" <MOberlander@interwestgrp.com>
To: <RMaizland@fcgov.com>, <SOLT@fcgov.com>
Date: 01/29/2007 12:42 PM
Subject: Letter of Intent - Lot 19 Prospect Industrial - Holsinger Drywall
CC: "Pat Hess" <HOLSINGERDRYWALL@QWEST.NET>, "Brett
Brown" <BBrown@dohnconstruction.com>, "Don Brookshire"
<eastpoint@frii.com>
Randy and Steve -
Attached is the first letter of intent for the project. It is from Liberty Common School to the north. I submitted 5
copies of the Plat to Steve on Friday, so hopefully the last thing we need prior to scheduling the hearing is the
letter from the owner of Lot 18 to the east.
Randy — I have templates for easements to the City, but not for slope easements. Does engineering have a
template that we can use for dedicating the easements?
Please let me know if there will be anything else (other than the last letter) that would be needed for the hearing to
be scheduled.
Thanks.
Mike
Michael Oberlander, PE
Interwest Consulting Group
Office 970-674-3300 x101
Cell 970-631-2671
file://C:\Documents%20and%20Settings\solt\Local%20Settings\Temp\GW)0000I.HTM 01/29/2007